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Thermal Management

CVD DIAMOND FOR HIGHER POWER DENSITY

Element Six’s CVD diamond heat spreaders provide enhanced thermal management capabilities, enabling greater system performance, stability, and device life. Run higher power levels or faster processes without increasing operating temperatures.

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The limitations of conventional thermal management solutions can put a tight bottleneck on devices and components. This forces system designers in the semiconductor, aerospace, telecommunications, and defence industries to compromise between size, performance and reliability.

Chemical Vapour Deposition (CVD) diamond heat spreaders can help you reduce thermal management bottlenecks and achieve lower operating temperatures, improved performance and extended system life in a range of electronics applications.

Element Six has the in-house expertise, end-to-end development capabilities, and scalable resources to create CVD diamond solutions that meet your exact thermal requirements.

When you collaborate with us, you gain access to a CS Industry award-winning thermal solution manufacturer that can go beyond single components to understand and solve thermal management challenges across your entire system.

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Find out the specific details of the performance of our supermaterials and how they apply to your industry:

Discover our thermal grades

Buy samples of our thermal material grades on our CVD webstore. 

 

See our thermal management solutions at work

Step change thermal management of RF devices using CVD diamond

Thermal conductivity can be engineered to suit the application, but it is necessary to consider the system as a whole in order to achieve maximum benefits.

For active devices CVD diamond heat spreaders enable:

- Higher power operation for a given maximum operating temperature
- Reduced peak temperatures (~25%) for a given power

RF resistors using CVD diamond substrates can operate at higher frequencies and powers before parasitic effects lead to signal distortion (>100w & > 10 GHz). |  Read more

Thermal Satellite

Improved performance

When electronic devices overheat, system performance and service life can quickly degrade.

CVD diamond heat spreaders can more than double overall system productivity in GaN solid state RF X-band PAs, advanced Si processors and ASICs, and laser diodes alike.

Oil and Gas Thermal Gun

Greater heat sinking capabilities

CVD diamond enables you to run at higher power levels without increasing junction-operating temperature. For multifinger power devices and diode arrays, efficient heat sinking reduces thermal cross talk which is fundamental for stable performance and device life. 

Do you want to learn more about how our diamond heat spreaders cool hot spots in silicon chips? Read our new case study or contact us at e6marketing@e6.com today.

Oil and Gas Thermal Computer

Quality And Consistency

Copper, silicon carbide, and aluminium nitride offer a certain level of thermal management, but often struggle to deliver the performance required by high-power RF and optoelectronics systems. 

Our TM200 offers 5x more room temperature thermal conductivity than copper, and 8 to 10x more than other commonly used ceramic heat spreaders such as beryllia and aluminium nitride.

Thermal Satellite

Discover Cu-Diamond

A high performance copper-diamond composite for demanding thermal management applications.
 
Formed by a unique manufacturing process, these copper-diamond composite materials have a thermal conductivity and coefficient of thermal expansion between copper and diamond and are an ideal choice of heat spreader for a range of high-power density semiconductor device applications, including:

- high end AI chips for high performance computing
- RF power amplifiers for defense and wireless communications
- power modules for reliable power conversion
- high power semiconductor lasers

Read more or contact us today to find out more.

Cu-Diamond materials